AMD announced its purchase of HBM4 ultra-high-range memory from Samsung for use in its upcoming “Instinct MI455X” processor dedicated to accelerating artificial intelligence, as well as in the sixth generation of AMD Epyc processors called Venice.
Intelligent data center operators can combine Instinct processors with Epyc processors and server-level stack architectures like the AMD Helios platform to support future AI systems.
Today, the two companies announced a memorandum of understanding at Samsung’s advanced chip manufacturing complex in Pyeongtaek, Korea, in the presence of AMD CEO Dr. Lisa Su and Samsung Electronics Chairman Young Hyun-joon.
Young Hyun Jun noted, “Samsung and AMD share a commitment to advancing AI computing, and this agreement reflects the expansion of our collaboration, from industry-leading HBM4 and advanced memory architectures to cutting-edge manufacturing services and advanced packaging, enabling comprehensive capabilities to support AMD’s AI roadmap.”
Dr. Lisa Su added: “Powering the next generation of AI infrastructure requires deep cross-industry collaboration. We are excited to expand our collaboration with Samsung, by combining their leadership in advanced memory and our Instinct and Epyc processors and packet platforms, to accelerate AI innovation and its practical impact at scale.”
Samsung’s HBM4 is manufactured using 10nm technology and a 4nm logic base, and has a processing speed of 13Gbps with a maximum bandwidth of 3.3TB/s.
The two companies will also collaborate on high-performance DDR5 memory optimized for 6th Generation Epyc processors, and will explore manufacturing partnership opportunities to provide Foundry services for future AMD products.
